Low Energy Ion Implantation and Annealing of Au/Ni/Ti Contacts to n-SiC Academic Article uri icon

abstract

  • ABSTRACTThe electrical characteristics of Au/Ni/Ti/ n-SiC contacts have been examined as a function of implant dose (1013-1014 ions/cm2) at 5 KeV and temperature of annealing (750-1000 °C). Measurements of specific contact resistance, ρc, were approximately constant at lower implant doses until increasing at 1 x 1015 ions/cm2 for both C and P ions. Annealing at a temperature of 1000 °C has reduced the value of ρc by an order of magnitude to ∼1 x 10-6 Ω.cm2 at implant doses of 1013-1014 ions/cm2. Auger Electron Spectroscopy (AES) has shown that annealing at 1000 °C resulted in a strong indiffusion of the metallization layers at the interface.

authors

  • Shrestha, Neelu
  • Kibel, Martyn H
  • Leech, Patrick W
  • Holland, Anthony S
  • Reeves, Geoffrey K
  • Ridgway, Mark C
  • Tanner, Phillip

publication date

  • 2017